Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration
by John Lau(Author)
Formats
Hardback/English
USD 207.80
Description
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading suchElectronicscircuitsgeneral
Electronicsgeneral
Physicscondensed Matter
Electronicssemiconductors
Chemical & Biochemical
